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Intel Lakefield HC31 Cover
Intel Lakefield is a 3D Foveros SoC with a number of firsts including an IO die, hybrid cores, and DRAM all into a low power package
Jintide Platform Overview Hot Chips 31
The Jintide security auditing platform for Intel Xeon CPUs was shown at Hot Chips 31 which offers components and tooling to validate processor operation
Intel NNP I 1000 Spring Hill Cover
At Hot Chips 31, Intel showed off Spring Hill. The Intel NNP-I 1000 series is designed to bring AI inferencing offload to a M.2 form factor
IBM POWER9 Processor Common Features
IBM open-sources the Power ISA and aligns OpenPower to Linux Foundation putting together what may be the new front-runner in future x86 competitors
Cerebras Wafer Scale Engine Size
At Hot Chips 31 (2019) the Cerebras Wafer Scale Engine stole the show as being an AI chip so large that it is the biggest chip possible on a 300mm wafer
IBM Power9 Talk At Hot Chips 31
At Hot Chips 31 (2019) we got a look at the IBM Power9 Advanced IO chip which brings PCIe Gen4, next-gen NVIDIA NVLink, and OMI memory to the platform
Crushing Cinebench V5 AMD EPYC 7742 Cover
In casually testing a 128 core and 256 thread AMD EPYC 7742 solution we managed to set a world record for Cinebench R15 and Cinebench R20
Intel Xeon W 3200 Launch SKUs And Value Analysis
Our Intel Xeon W-3200 series SKU list and value analysis shows the features of the line how these high clock speed and core count SKUs are priced
SK.Hynix Gold S31 Cover
SK.Hynix Gold S31 SATA SSDs are now out offering SATA III SSD pricing of under $0.125 per GB as the company re-enters the branded SSD market
Counterfeit Intel Xeon E5 2683 V4 Closer
We look at reports of counterfeit Intel Xeon E5 CPUs being remarked and sold in a potentially dangerous practice for unknowing buyers