At Hot Chips 33 we learned more about the Qualcomm Cloud AI 100 AI Inference card for lower power data center and edge inferencing
The Enflame DTU 1.0 is an AI compute chip that we do not often get to see. Hot Chips 33 was one of the first presentations we have seen on it
The Esperanto ET-SoC-1 20W AI inferencing chip combines 1088 RISC-V in-order cores with vector/ tensor units and 4 RISC-V out-of-order cores
Samsung shared its vision for PIM compute with its HBM2-PIM at Hot Chips 33. The presentation had a few Easter Eggs too
For Hot Chips 33 Intel went into more details around its new IPU member, the Intel Mount Evans DPU that has a lot of innovation in a new ASIC
During Hot Chips 33, we got a deeper dive into the NVIDIA BlueField-3 DPU architecture which is a 2022 product we are excited about
At Hot Chips 33 Arm reviewed its next-generation 5nm chip design dubbed the Arm Neoverse N2 core
At Hot Chips 33, Intel Sapphire Rapids Xeon had a few new disclosures compared to Architecture Day a few days ago
The IBM Z Telum was a hot subject at Hot Chips 33 and we got to see how the next generation of mainframe processors will innovate
At Hot Chips 33, AMD discussed Zen 3 including its 3D V-Cache prototype that offers 96MB L3 cache per CCD and 192MB on the Ryzen chip